Taiwan Semiconductor Manufacturing Company Ltd. (TSM)
343.90
+16.79 (5.13%)
NYSE · Last Trade: Jan 15th, 10:05 AM EST
Detailed Quote
Previous Close
327.11
Open
342.81
Bid
343.84
Ask
343.95
Day's Range
337.92 - 345.52
52 Week Range
134.25 - 336.42
Volume
10,811,804
Market Cap
8.92T
PE Ratio (TTM)
-
EPS (TTM)
-
Dividend & Yield
3.340 (0.97%)
1 Month Average Volume
10,845,679
Chart
About Taiwan Semiconductor Manufacturing Company Ltd. (TSM)
Taiwan Semiconductor Manufacturing Company (TSMC) is a leading semiconductor foundry that specializes in the production of advanced integrated circuits and microchips for various applications in technology sectors such as telecommunications, computing, and consumer electronics. The company operates state-of-the-art fabrication facilities and leverages cutting-edge manufacturing processes, enabling it to produce high-performance and energy-efficient chips. TSMC collaborates with a broad array of clients, including major technology firms, to support their innovation and growth by providing reliable and scalable chip manufacturing services. With a commitment to research and development, TSMC plays a critical role in advancing semiconductor technology, driving the digital transformation across multiple industries worldwide. Read More
As of January 15, 2026, the era of a single, unified global semiconductor market has officially come to an end. Following a quiet but firm December 2025 directive from Beijing, Chinese chipmakers are now operating under a strict 50% domestic equipment mandate. This policy requires all new fabrication facilities and capacity expansions to source at [...]
The dawn of 2026 marks a pivotal turning point in the artificial intelligence arms race. For years, the industry was defined by a desperate scramble for high-end GPUs, but the narrative has shifted from procurement to production. Today, the world’s largest hyperscalers—Alphabet Inc. (NASDAQ: GOOGL), Amazon.com, Inc. (NASDAQ: AMZN), Microsoft Corp. (NASDAQ: MSFT), and Meta [...]
In a move that signals the intensifying arms race for artificial intelligence hardware, SK Hynix (KRX: 000660) announced on January 13, 2026, a staggering $13 billion (19 trillion won) investment to construct its most advanced semiconductor packaging facility to date. Named P&T7 (Package & Test 17), the massive hub will be located in the Cheongju [...]
As the first half of January 2026 draws to a close, the landscape of artificial intelligence infrastructure has been irrevocably altered by a series of landmark announcements at CES 2026. The world's two premier chipmakers, NVIDIA (NASDAQ:NVDA) and AMD (NASDAQ:AMD), have officially moved beyond the era of individual graphics cards, entering a high-stakes competition for [...]
As artificial intelligence models grow from billions to trillions of parameters, the physical infrastructure supporting them has hit a "power wall." Traditional copper interconnects and pluggable optical modules, which have served as the backbone of data centers for decades, are no longer able to keep pace with the massive bandwidth demands and extreme energy requirements [...]
As the demand for generative AI pushes semiconductor design to its physical breaking point, a fundamental shift in materials science is taking hold across the industry. In a move that signals the end of the traditional plastic-based era, industry titans Intel and Samsung have transitioned into a high-stakes race to commercialize glass substrates. This "Glass [...]
As the artificial intelligence revolution accelerates into 2026, the industry has officially collided with a physical barrier: the "Thermal Wall." With the latest generation of AI accelerators now demanding upwards of 1,000 to 2,300 watts of power, traditional air cooling and even standard liquid-cooled cold plates have reached their limits. In a landmark shift for [...]
As of January 15, 2026, the semiconductor landscape has undergone its most significant shift in a decade. Intel Corporation (NASDAQ: INTC) has officially declared its 18A (1.8nm-class) process node ready for the global stage, confirming that it has achieved high-volume manufacturing (HVM) with stable yields surpassing the critical 60% threshold. This milestone marks the successful [...]
The unveiling of NVIDIA’s (NASDAQ: NVDA) next-generation Rubin architecture has officially ignited the "HBM4 Memory War," a high-stakes competition between the world’s three largest memory manufacturers—SK Hynix (KRX: 000660), Samsung Electronics (KRX: 005930), and Micron Technology (NASDAQ: MU). Unlike previous generations, this is not a mere race for capacity; it is a fundamental redesign of [...]
In a landmark keynote at the 2026 Consumer Electronics Show (CES) in Las Vegas, NVIDIA (NASDAQ: NVDA) CEO Jensen Huang officially introduced the "Vera Rubin" architecture, a comprehensive platform redesign that signals the most aggressive expansion of AI compute power in the company’s history. Named after the pioneering astronomer who confirmed the existence of dark [...]
In a landmark move for the American semiconductor industry, Intel Corporation (NASDAQ: INTC) has officially launched its "Panther Lake" processors at CES 2026, marking the first time a high-volume consumer AI PC platform has been manufactured using the cutting-edge Intel 18A process on U.S. soil. Branded as the Intel Core Ultra Series 3, these chips [...]
The semiconductor industry is undergoing its most significant structural transformation since the dawn of extreme ultraviolet (EUV) lithography. As the global chip market surges toward a projected $1 trillion valuation by the end of the decade, a new "Green Fab" movement is shifting the focus from raw processing power to resource circularity. This paradigm shift [...]
